Samsung has announced that is has started mass production of Exynos 7 Dual 7270 processor for wearables that is based on 14nm FinFET process technology. It also has LTE modem integration, making it the first in class with built-in LTE. It recentlystarted mass production of Exynos 7 Quad 7570 14nm processor for budget smartphones and IoT devices.
The Exynos 7270 uses Samsung’s innovative packaging technology, SiP (system-in-package)-ePoP (embedded package-on-package) that promises outstanding performance and energy-efficiency within a compact solution optimized for wearable devices.
This technology combines the AP, DRAM and NAND flash memory chips as well as the PMIC (power management IC) together into a single package. The solution can offer more features than its predecessor in the same 100-square-millimeter (mm2) area while reducing the height by approximately 30%. This gives more room for device manufacturers to design high performance, ultra-slim wearable devices.
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